Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level personnel ...
KAOHSIUNG, Aug. 28, 2025 /PRNewswire/ -- As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 ...
Chairman Jim Hung said Innolux will deprioritize shipment volume for its fan-out panel-level packaging (FOPLP) business in ...
Artificial intelligence (AI) has emerged as a major catalyst for innovation and advancement. The growing demand for AI computing power is driving heterogeneous integration toward larger packaging ...
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