SAN FRANCISCO, CA--(Marketwired - Jul 7, 2014) - SEMICON West --Roth & Rau - Ortner, a specialist in optimizing production flows in complex manufacturing environments, today introduced the FOUP Purge ...

Four years ago, Intel and Micron partnered to form Intel-Micron Flash Technology. The operation is based in Lehi, Utah, at this sprawling fabrication plant nestled in a hilly landscape. The two-level ...

Gudeng Precision Industrial has enjoyed a ramp-up of front opening unified pod (FOUP) orders from 12-inch IC foundries in China and Taiwan, while shipments of its extreme ultraviolet (EUV) pods has ...

LINCOLNSHIRE, Ill.--(BUSINESS WIRE)--TDK Corporation, the world’s leading supplier of loadports, will feature Hybrid TM N 2 Purge loadports for the next generation FABs at SEMICON West 2013 at the ...

They’re called FOUPs, for front-opening unified pods, they number in the thousands and they’re zipping around continuously overhead. No, it’s not the climactic invasion scene from Hollywood’s latest ...

Brooks Automation Inc. today announced that Tokyo Electron Ltd. (TEL) of Japan has licensed key elements of its patented 300mm front opening unified pod (FOUP) Load Port technology for use in all of ...

Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics (HLMC) and Shanghai ...

CHELMSFORD, Mass.–Brooks Automation Inc. today (March 19) announced it has licensed key portions of its patented 300-mm front opening unified pod (FOUP) wafer loading port technology to Tokyo Electron ...

Across the semiconductor industry, ensuring cleanrooms and mini-environments are sufficiently monitored for particle sizes down to 100 nm is a common practice. Most industries have adopted this ...

New Delhi, Sept. 03, 2024 (GLOBE NEWSWIRE) -- The global front opening unified pods market is projected to hit the market valuation of US$ 93.73 million by 2032 from US$ 42.10 million in 2023 at a ...