SAN JOSE, Calif. — IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Toshiba aims to strengthen position as leader in semiconductor innovation, and accelerates development of next-gen power ...

Siemens has introduced Siemens’ electronic design automation software to enhance its power devices and analogue semiconductor ...

ROME, June 20, 2023 /PRNewswire/ -- An internationally respected System/ASIC company is adopting MZ Technologies' GENIO™ 1.7 fully-integrated EDA co-design tool. The company adopted a full-suite ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond Tool, ...

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...